Underfill

Depending on your individual requirements we offer different search and selection functions to help you find the appropriate material. The listed products are an extract from our actual product portfolio. More products are available on request.

Do you need further information about our adhesives for electronic applications? Please get in touch with us. We are looking forward to your email to bectron.elantas.europe@remove-this.altana.remove-this-also.com.

ProductCuringcuring
conditions

Temp. Range (°C)

Viscostiy (Pas)

Tg (°C)

Density (g/cm³)

Description

Elan-glue® EP 5330

Thermal cure15 min @ 150°C or 15s @ 190°Cup to +150°C201601.6one-component system, medium viscosity, ochre, chlorine < 5ppm
Elan-glue® EP 5610UV cure / thermal cure150mW/cm2  UVA @ 5s+ RT or 1h @ 150°Cup to +150°C11251.2one-component system, low viscous, colourless/yellowish, good adhesion on metal/plastic/glass, low thermal expansion - CTE (<Tg) = 70ppm

Elan-glue® EP 5620

Thermal cure10min @ 130°Cup to +130°C0.8 (D=3s-1) 1.15one-component system, low viscous, colourless, short temperature resistance up to 160°C